Organic contamination deposited on wafer surfaces can impact deposition and cleaning processes. The current measurement method for organic contaminants uses TD-GCMS, but the industry needs measurement of all organics on the wafer surface at lower levels than is possible using this method. This presentation proposes a novel approach which is much more sensitive than the current industry standard and is capable of measuring high molecular weight, high boiling point contaminants. Through it, the root causes of excursions can be quickly identified and dealt with.