Building Operational Resilience into Semiconductor End of Pipe Zero Liquid Discharge Wastewater Recovery Facilities

Date Published: 2024 | Conference materials

Log in or Join UltraFacility to access this content

To access our resources you will need to be a member of UltraFacility, log in to your account or purchase a membership to view this content.

Already have an account? Log in

As EOP/ZLD becomes a necessary feature at every fab campus to decouple semiconductor manufacturing from constrained water resources, it will become critical for these EOP/ZLD facilities to include sufficient operational resilience to minimize the potential for a campus-wide impact. This paper defines potential failure mechanisms as well as offer several strategies– ranging from on-site business processes to close collaboration with the local POTW – to prevent or minimize the campus downtime resulting from an excursion at the wastewater treatment and reclaim plant.

Authors: John Rydzewski
Tags: Zero Liquid Discharge (ZLD)End-of-Pipe

Related content

Conference material | 2024
RO and NF Membranes used for Energy Saving and Meeting Sustainability Goals for Wastewater ZLD Systems
Conference material | 2024
Emerging High-Strength Wastewater Treatment Tools: OARO Brine Concentration and Modular Flexible Crystallizers
Conference material | 2023
Enabling ESG Goals via Sustainable Zero Liquid Discharge
Conference material | 2024
Alternative Solution for the High pH RO Process in the Semiconductor Industry A Techno-Economic Comparison of an Innovative Brine Minimization Technology

Back to Technical Knowledge Base

Not an UltraFacility Member?

Be part of year-round collaboration and knowledge exchange. Get access to the full range of tools leveraged by facility representatives and leading global experts from across the supply chain.

Book a demo

Find out how you can leverage UltraFacility Portal to achieve your business objectives today.

Request a demo