Modern semiconductor devices face tremendous manufacturing challenges due to the ever increasing complexity of the device. In today's most advanced fabs, bulk gases, such as nitrogen, oxygen, argon, helium etc., which are used throughout the manufacturing process have to meet sub-part-per-billion (ppb) impurity specifications; however, semiconductor companies constantly push for lower limits and therefore demand improved analytical devices. At the same time, systems should be low on maintenance and operating costs. For instance, helium carrier gas required by sub-ppb gas chromatographs (GCs) is a huge cost factor that fabs seek to eliminate.