Dan’s almost three decades of experience as a facilities engineering manager, process engineer, design engineer, construction project manager and tool hookup design in the advanced technologies and semiconductor manufacturing industry has led to innovative solutions in his work. His innovations have resulted in industry-changing quality and cost savings breakthroughs, including defect reduction and innovative water reclaim and re-use systems. Dan is well established in the semiconductor industry as an Ultra-pure Water, UHP Chemical and Wastewater expert as shown in his leadership of industry roadmap and collaboration teams. He is certified by ASQ as a six sigma black belt. His roles include Co-Chair of International Roadmap for Device and Systems (IRDS) Yield Enhancement (YE) team, Co-Chair UPW SEMI Standards team, and UP Micro Conference Strategy Team. In addition to many industry publications, Dan also holds a patent for Reduction of Charging Induced Damage in Photolithography Wet Process.